Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12113027 | Three-dimensional integrated circuit structures and methods of forming the same | Chung-Yu Lu, Sao-Ling Chiu | 2024-10-08 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Chih-Ta Shen +5 more | 2024-04-23 |
| 11916009 | Semiconductor package and manufacturing method thereof | Chi-Ming Huang, Sao-Ling Chiu, Shang-Yun Hou | 2024-02-27 |