Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148719 | Forming large chips through stitching | Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2024-11-19 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Shu Lin, Tsung-Yu Chen | 2024-09-17 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Hsien-Pin Hu | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu | 2024-03-05 |
| 11888700 | Method and apparatus for fine-grained isolation in CN NSS domain of E2E network slice | Zhiyuan Hu, Jing PING, Zhigang Luo | 2024-01-30 |
| 11877147 | Methods, device and computer-readable medium for protecting MAC addresses | Zhiyuan Hu, Mingyu Zhao, Yueming Yin, Zhigang Luo | 2024-01-16 |