Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Heh-Chang Huang +8 more | 2024-06-18 |
YL
Yushun Lin
Overall (2024): #201,375 of 561,600Top 40%
1
Patents 2024