Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2024-05-07 |