Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996346 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shin-Puu Jeng | 2024-05-28 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2024-05-07 |