Issued Patents 2024
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183714 | Package structures and method for forming the same | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-12-31 |
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-12-17 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12148684 | Package structure and method | Che-Chia Yang, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-11-19 |
| 12125822 | Method of manufacturing a semiconductor device package having dummy dies | Che-Chia Yang, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-10-22 |
| 12119296 | Encircling a semiconductor device with stacked frames on a substrate | Chien-Hung Chen, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-10-15 |
| 12113006 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-10-08 |
| 12100664 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2024-09-24 |
| 12094828 | Eccentric via structures for stress reduction | Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2024-09-17 |
| 12074101 | Package structure and method of fabricating the same | Yu-Sheng Lin, Han-Hsiang Huang, Chien-Sheng Chen, Shin-Puu Jeng | 2024-08-27 |
| 12074083 | Semiconductor die package with thermal management features | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2024-08-27 |
| 12068260 | Semiconductor die package with ring structure and method for forming the same | Yu-Chen Lee, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-08-20 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12033906 | Semiconductor package and manufacturing method thereof | Che-Chia Yang, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033871 | Method for forming semiconductor die package with ring structure comprising recessed parts | Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033913 | Chip package structure with lid and method for forming the same | Che-Chia Yang, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033928 | Manufacturing method of semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033947 | Semiconductor package structure and method for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12021042 | Semiconductor package and method of manufacturing the same | Kai-Ming Ching, Chien-Hung Chen, Hui Yu, Yu-Min Cheng | 2024-06-25 |
| 12009278 | Package structure with buffer layer embedded in lid layer | Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 12009276 | Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same | Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 11996346 | Semiconductor device and manufacturing method thereof | Po-Yao Lin, Hui Yu, Shyue-Ter Leu, Shin-Puu Jeng | 2024-05-28 |
| 11997842 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-05-28 |
| 11984378 | Semiconductor package structure and method for forming the same | Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2024-05-14 |
| 11978722 | Structure and formation method of package containing chip structure with inclined sidewalls | Po-Chen Lai, Che-Chia Yang, Li-Ling Liao, Po-Yao Lin, Shin-Puu Jeng | 2024-05-07 |