Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166091 | LDMOS transistor and method for manufacturing the same | Meng Wang | 2024-12-10 |
| 12119343 | Semiconductor structure having a semiconductor substrate and an isolation component | Yicheng Du, Meng Wang | 2024-10-15 |
| 12021042 | Semiconductor package and method of manufacturing the same | Kai-Ming Ching, Shu-Shen Yeh, Chien-Hung Chen, Yu-Min Cheng | 2024-06-25 |
| 11996346 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2024-05-28 |
| 11978715 | Structure and formation method of chip package with protective lid | Meng-Tsung KUO, Chih-Kung Huang, Wei-Teng Chang | 2024-05-07 |
| 11967644 | Semiconductor device comprising separate different well regions with doping types | Meng Wang, Yicheng Du | 2024-04-23 |
| 11942540 | Semiconductor device and method for manufacturing the same | Meng Wang, Yicheng Du | 2024-03-26 |