CH

Chih-Kung Huang

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #512,127 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11978715 Structure and formation method of chip package with protective lid Meng-Tsung KUO, Hui Yu, Wei-Teng Chang 2024-05-07