Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978715 | Structure and formation method of chip package with protective lid | Meng-Tsung KUO, Hui Yu, Chih-Kung Huang | 2024-05-07 |
WC
Wei-Teng Chang
Overall (2024): #225,521 of 561,600Top 45%
1
Patents 2024