Meng-Tsung KUO

TSMC: 1 patents #2,264 of 4,162Top 55%

📍 Tainan, TW: #299 of 783 inventorsTop 40%

Overall (2024): #347,206 of 561,600Top 65%

Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
11978715	Structure and formation method of chip package with protective lid	Hui Yu, Chih-Kung Huang, Wei-Teng Chang	2024-05-07