Issued Patents 2024
Showing 1–25 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183714 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-12-31 |
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung +1 more | 2024-12-24 |
| 12176258 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2024-12-24 |
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee +1 more | 2024-12-24 |
| 12170274 | Semiconductor packages and methods of forming same | Techi Wong, Po-Yao Chuang, Shuo-Mao Chen, Meng-Wei Chou | 2024-12-17 |
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2024-12-17 |
| 12165980 | Semiconductor package and methods of manufacturing | Hsien-Wei Chen, Meng-Liang Lin | 2024-12-10 |
| 12166025 | Semiconductor devices and methods of manufacturing | Chang-Yi Yang, Po-Yao Chuang | 2024-12-10 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin | 2024-11-26 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen | 2024-11-26 |
| 12148684 | Package structure and method | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin | 2024-11-19 |
| 12131984 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2024-10-29 |
| 12132021 | Method for fabricating semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2024-10-29 |
| 12125755 | Chip package structure with cavity in interposer | Feng-Cheng Hsu, Shuo-Mao Chen | 2024-10-22 |
| 12125822 | Method of manufacturing a semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin | 2024-10-22 |
| 12125833 | Integrated circuit package and method forming same | Shuo-Mao Chen, Feng-Cheng Hsu | 2024-10-22 |
| 12119296 | Encircling a semiconductor device with stacked frames on a substrate | Chien-Hung Chen, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-10-15 |
| 12113006 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-10-08 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2024-10-08 |
| 12113033 | Chip package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao +1 more | 2024-10-08 |
| 12100666 | Method for forming chip package structure | Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2024-09-24 |
| 12100664 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin | 2024-09-24 |
| 12094810 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu | 2024-09-17 |
| 12094819 | Method for forming package structure | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang | 2024-09-17 |
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Chia-Hsiang Lin | 2024-09-17 |