Issued Patents 2024
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Li-Ling Liao, Tsung-Yen Lee, Po-Yao Lin +1 more | 2024-12-24 |
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-12-17 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Feng-Cheng Hsu, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-11-26 |
| 12132021 | Method for fabricating semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2024-10-29 |
| 12125822 | Method of manufacturing a semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-10-22 |
| 12113033 | Chip package structure | Po-Chen Lai, Chin-Hua Wang, Chia-Kuei Hsu, Li-Ling Liao, Po-Yao Lin +1 more | 2024-10-08 |
| 12100666 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Po-Hao Tsai, Po-Yao Chuang | 2024-09-24 |
| 12100664 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2024-09-24 |
| 12094810 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2024-09-17 |
| 12057363 | Chip package structure with multiple gap-filling layers and fabricating method thereof | Po-Chen Lai, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2024-08-06 |
| 12040285 | Structure and formation method of chip package with reinforcing structures | Po-Chen Lai, Po-Yao Lin, Yu-Sheng Lin, Shin-Puu Jeng | 2024-07-16 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12035475 | Semiconductor package with stress reduction design and method for forming the same | Chia-Kuei Hsu, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033947 | Semiconductor package structure and method for forming the same | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033928 | Manufacturing method of semiconductor package | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12021045 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2024-06-25 |
| 12014969 | Package structure and method for forming the same | Po-Chen Lai, Li-Ling Liao, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-18 |
| 12009278 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 11997842 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-05-28 |
| 11984381 | Semiconductor package structure and method for forming the same | Po-Chen Lai, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2024-05-14 |
| 11908757 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-02-20 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |