Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin +1 more | 2024-12-24 |
| 12113033 | Chip package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin +1 more | 2024-10-08 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12014969 | Package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-18 |
| 11978722 | Structure and formation method of package containing chip structure with inclined sidewalls | Shu-Shen Yeh, Po-Chen Lai, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2024-05-07 |