Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2024-12-24 |
| 12124178 | Lithography system and method | Hao-Yu Lan, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2024-10-22 |
| 11982944 | Method of lithography process and transferring a reticle | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2024-05-14 |
| 11984314 | Particle removal method | Siao-Chian Huang, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2024-05-14 |
| 11967582 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |