Issued Patents 2024
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183714 | Package structures and method for forming the same | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-12-31 |
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee, Po-Yao Lin +1 more | 2024-12-24 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Yu-Sheng Lin, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12148684 | Package structure and method | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-11-19 |
| 12113006 | Semiconductor package | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-10-08 |
| 12113033 | Chip package structure | Po-Chen Lai, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao, Po-Yao Lin +1 more | 2024-10-08 |
| 12074083 | Semiconductor die package with thermal management features | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Shin-Puu Jeng | 2024-08-27 |
| 12057363 | Chip package structure with multiple gap-filling layers and fabricating method thereof | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-08-06 |
| 12033871 | Method for forming semiconductor die package with ring structure comprising recessed parts | Yu-Sheng Lin, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033913 | Chip package structure with lid and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033906 | Semiconductor package and manufacturing method thereof | Shu-Shen Yeh, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12014969 | Package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin, Shin-Puu Jeng | 2024-06-18 |
| 12009276 | Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 11997842 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-05-28 |
| 11990418 | Chip package structure with buffer structure and method for forming the same | Po-Chen Lai, Ping-Tai CHEN, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin +1 more | 2024-05-21 |
| 11984381 | Semiconductor package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-05-14 |
| 11984378 | Semiconductor package structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Yu-Sheng Lin, Shin-Puu Jeng | 2024-05-14 |
| 11973001 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-04-30 |
| 11967582 | Multi-chip device and method of formation | Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11967547 | Solder resist structure to mitigate solder bridge risk | Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11915992 | Method for forming package structure with lid | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen | 2024-02-27 |
| 11894320 | Semiconductor device package with stress reduction design and method of forming the same | Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-02-06 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |
| 11862580 | Semiconductor package | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |
| 11862528 | Method for forming semiconductor package | Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2024-01-02 |