Issued Patents 2024
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-12-17 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12154888 | Semiconductor package and method of manufacturing the same | Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-11-26 |
| 12148684 | Package structure and method | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-11-19 |
| 12132021 | Method for fabricating semiconductor package | Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2024-10-29 |
| 12113033 | Chip package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2024-10-08 |
| 12100664 | Semiconductor device with curved conductive lines and method of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2024-09-24 |
| 12094810 | Reinforcing package using reinforcing patches | Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2024-09-17 |
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2024-09-17 |
| 12068260 | Semiconductor die package with ring structure and method for forming the same | Yu-Chen Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-08-20 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12035475 | Semiconductor package with stress reduction design and method for forming the same | Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033947 | Semiconductor package structure and method for forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033928 | Manufacturing method of semiconductor package | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 11973001 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-04-30 |
| 11908757 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-02-20 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |