Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068260 | Semiconductor die package with ring structure and method for forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-08-20 |
YL
Yu-Chen Lee
Overall (2024): #201,626 of 561,600Top 40%
1
Patents 2024