Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-09-17 |