Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170274 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Meng-Wei Chou | 2024-12-17 |
| 12159791 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee | 2024-12-03 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12125833 | Integrated circuit package and method forming same | Shin-Puu Jeng, Feng-Cheng Hsu | 2024-10-22 |
| 12125755 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Feng-Cheng Hsu | 2024-10-22 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2024-10-08 |
| 12094810 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng | 2024-09-17 |
| 12046548 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Techi Wong | 2024-07-23 |
| 11948914 | Chip package structure with integrated device integrated beneath the semiconductor chip | Feng-Cheng Hsu, Shin-Puu Jeng | 2024-04-02 |
| 11942408 | Semiconductor structure and manufacturing method thereof | Feng-Cheng Hsu, Shin-Puu Jeng | 2024-03-26 |
| 11935837 | Photonics integrated circuit package | Feng-Wei Kuo, Chewn-Pu Jou | 2024-03-19 |
| 11915992 | Method for forming package structure with lid | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Chin-Hua Wang | 2024-02-27 |
| 11908764 | Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity | Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shin-Puu Jeng | 2024-02-20 |
| 11887952 | Semiconductor device encapsulated by molding material attached to redistribution layer | Shin-Puu Jeng, Feng-Cheng Hsu | 2024-01-30 |
| 11862469 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shin-Puu Jeng | 2024-01-02 |