Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908764 | Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity | Meng-Liang Lin, Po-Yao Chuang, Shuo-Mao Chen, Shin-Puu Jeng | 2024-02-20 |