Issued Patents 2024
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Meng-Liang Lin, Techi Wong, Shih-Ting Hung, Po-Hao Tsai +1 more | 2024-12-24 |
| 12170274 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Shuo-Mao Chen, Meng-Wei Chou | 2024-12-17 |
| 12166025 | Semiconductor devices and methods of manufacturing | Chang-Yi Yang, Shin-Puu Jeng | 2024-12-10 |
| 12131984 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Shin-Puu Jeng, Techi Wong | 2024-10-29 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Feng-Cheng Hsu, Po-Yao Lin | 2024-10-08 |
| 12100666 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Hao Tsai | 2024-09-24 |
| 12094819 | Method for forming package structure | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng | 2024-09-17 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Shin-Puu Jeng | 2024-08-27 |
| 12057424 | Package structure and method for forming the same | Meng-Liang Lin, Shin-Puu Jeng | 2024-08-06 |
| 12051654 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Shih-Ting Hung | 2024-07-30 |
| 12046548 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2024-07-23 |
| 12021045 | Semiconductor device and method of manufacture | Po-Hao Tsai, Ming-Chih Yew, Shin-Puu Jeng | 2024-06-25 |
| 11996606 | Heterogeneous antenna in fan-out package | Po-Hao Tsai, Shin-Puu Jeng | 2024-05-28 |
| 11996372 | Semiconductor device and method of manufacture | Po-Hao Tsai, Shin-Puu Jeng | 2024-05-28 |
| 11948892 | Formation method of chip package with fan-out feature | Po-Hao Tsai, Meng-Liang Lin, Techi Wong, Shin-Puu Jeng | 2024-04-02 |
| 11908764 | Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity | Meng-Liang Lin, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng | 2024-02-20 |
| 11901279 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu | 2024-02-13 |
| 11901307 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Meng-Wei Chou, Shin-Puu Jeng | 2024-02-13 |
| 11901277 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu | 2024-02-13 |