Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Shih-Ting Hung, Po-Hao Tsai +1 more | 2024-12-24 |
| 12170274 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Po-Yao Chuang, Shuo-Mao Chen, Meng-Wei Chou | 2024-12-17 |
| 12131984 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2024-10-29 |
| 12100666 | Method for forming chip package structure | Shin-Puu Jeng, Po-Yao Lin, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2024-09-24 |
| 12094819 | Method for forming package structure | Po-Hao Tsai, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng | 2024-09-17 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Po-Hao Tsai, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2024-08-27 |
| 12046548 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen | 2024-07-23 |
| 11948892 | Formation method of chip package with fan-out feature | Po-Hao Tsai, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2024-04-02 |