Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Po-Hao Tsai +1 more | 2024-12-24 |
| 12051654 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2024-07-30 |
| 11901277 | Semiconductor package and method of manufacturing the same | Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |
| 11901279 | Semiconductor package and method of manufacturing the same | Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |