Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Techi Wong, Shih-Ting Hung, Po-Hao Tsai +1 more | 2024-12-24 |
| 12165980 | Semiconductor package and methods of manufacturing | Hsien-Wei Chen, Shin-Puu Jeng | 2024-12-10 |
| 12094819 | Method for forming package structure | Po-Hao Tsai, Techi Wong, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng | 2024-09-17 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Po-Yao Chuang, Shin-Puu Jeng | 2024-08-27 |
| 12057424 | Package structure and method for forming the same | Po-Yao Chuang, Shin-Puu Jeng | 2024-08-06 |
| 11948892 | Formation method of chip package with fan-out feature | Po-Hao Tsai, Po-Yao Chuang, Techi Wong, Shin-Puu Jeng | 2024-04-02 |
| 11908764 | Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity | Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng | 2024-02-20 |
| 11901277 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |
| 11901279 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |