Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170274 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Shuo-Mao Chen | 2024-12-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2024-08-27 |
| 11901307 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng | 2024-02-13 |