Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125741 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2024-10-22 |
| 12113055 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Shien Chen | 2024-10-08 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Hung-Jui Kuo +3 more | 2024-09-17 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2024-04-16 |
| 11862512 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2024-01-02 |