Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113055 | Stress reduction apparatus and method | Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2024-10-08 |
| 12107041 | Metal plate corner structure on metal insulator metal | Yuan-Yang Hsiao, Hsiang-Ku Shen, Dian-Hau Chen, Hsiao Ching-Wen | 2024-10-01 |
| 12068300 | Chip-on-wafer-on-substrate package with improved yield | Chia-Wei Chang, Ju-Min Chen, Jyun-Lin Wu | 2024-08-20 |
| 12046566 | Devices with through silicon vias, guard rings and methods of making the same | Min-Feng Ku, Ching-Pin Lin, Cheng-Chien Li | 2024-07-23 |
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Hong-Seng Shue, Ming-Da Cheng, Ching-Wen Hsiao, Yu-Tse Su, Chen-Shien Chen | 2024-07-16 |
| 11984422 | Semiconductor package and method of forming same | Li-Hsien Huang, SyuFong Li, Ching-Pin Lin, Jun He | 2024-05-14 |