HC

Hsiao Ching-Wen

TSMC: 2 patents #1,566 of 4,162Top 40%
Overall (2024): #160,434 of 561,600Top 30%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12142582 Organic interposer including a dual-layer inductor structure and methods of forming the same Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hong-Seng Shue, Ming-Da Cheng +1 more 2024-11-12
12107041 Metal plate corner structure on metal insulator metal Yuan-Yang Hsiao, Hsiang-Ku Shen, Dian-Hau Chen, Yao-Chun Chuang 2024-10-01