Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107041 | Metal plate corner structure on metal insulator metal | Yuan-Yang Hsiao, Dian-Hau Chen, Hsiao Ching-Wen, Yao-Chun Chuang | 2024-10-01 |
| 12080753 | Device structure with a redistribution layer and a buffer layer | Tsung-Chieh Hsiao, Yuan-Yang Hsiao, Ying-Yao Lai, Dian-Hau Chen | 2024-09-03 |
| 12057445 | Method of manufacturing a semiconductor device and a semiconductor device | Wen-Tzu Chen, Szu-Ping Tung, Guan-Yao Tu, Chen-Chiu Huang, Dian-Hau Chen | 2024-08-06 |
| 12027574 | Resistor structure | Chih-Fan Huang, Dian-Hau Chen, Yen-Ming Chen | 2024-07-02 |
| 11996356 | Low-stress passivation layer | Chun-Li Lin, Dian-Hau Chen | 2024-05-28 |
| 11990401 | Back-end-of-line passive device structure | Tsung-Chieh Hsiao, Yuan-Yang Hsiao, Chen-Chiu Huang, Dian-Hau Chen | 2024-05-21 |
| 11967573 | Redistribution layers and methods of fabricating the same in semiconductor devices | Dian-Hau Chen | 2024-04-23 |
| 11961880 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Ying-Yao Lai, Dian-Hau Chen | 2024-04-16 |
| 11955547 | Semiconductor device including an epitaxy region | Te-Jen Pan, Yu-Hsien Lin, Wei-Han Fan, Yun Jing Lin, Yimin Huang +1 more | 2024-04-09 |
| 11950432 | Semiconductor packages and method of manufacturing the same | Ku-Feng Lin, Liang-Wei Wang, Dian-Hau Chen | 2024-04-02 |
| 11937515 | MRAM structure for balanced loading | Chih-Fan Huang, Liang-Wei Wang, Chen-Chiu Huang, Dian-Hau Chen, Yen-Ming Chen | 2024-03-19 |
| 11935787 | Semiconductor device and a method for fabricating the same | Hui-Chi Chen, Jeng-Ya David Yeh | 2024-03-19 |
| 11923405 | Metal-insulator-metal structure and methods of fabrication thereof | Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen +2 more | 2024-03-05 |