Issued Patents 2024
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183697 | Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogen | Chih-Fan Huang, Yen-Ming Chen, Chih-Sheng Li, Hui-Chi Chen, Chih-Hung Lu | 2024-12-31 |
| 12133469 | Magnetic random access memory and manufacturing method thereof | Tsung-Chieh Hsiao, Yu-Feng Yin, Liang-Wei Wang | 2024-10-29 |
| 12107041 | Metal plate corner structure on metal insulator metal | Yuan-Yang Hsiao, Hsiang-Ku Shen, Hsiao Ching-Wen, Yao-Chun Chuang | 2024-10-01 |
| 12087714 | Reduction of cracks in passivation layer | Kuo-An Liu, Wen-Chiung Tu, Yuan-Yang Hsiao, Kai Tak Lam, Chen-Chiu Huang +1 more | 2024-09-10 |
| 12082510 | Magnetic tunnel junction device and method of forming the same | Chih-Fan Huang, Kai-Wen Cheng, Chen-Chiu Huang, Yen-Ming Chen | 2024-09-03 |
| 12080753 | Device structure with a redistribution layer and a buffer layer | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Ying-Yao Lai | 2024-09-03 |
| 12063790 | Structure and method for MRAM devices | Chih-Fan Huang, Wen-Chiung Tu, Liang-Wei Wang, Yen-Ming Chen | 2024-08-13 |
| 12057445 | Method of manufacturing a semiconductor device and a semiconductor device | Wen-Tzu Chen, Szu-Ping Tung, Guan-Yao Tu, Hsiang-Ku Shen, Chen-Chiu Huang | 2024-08-06 |
| 12057419 | Method for forming chip structure with conductive structure | Chih-Fan Huang, Mao-Nan Wang, Hui-Chi Chen, Yen-Ming Chen | 2024-08-06 |
| 12027574 | Resistor structure | Chih-Fan Huang, Hsiang-Ku Shen, Yen-Ming Chen | 2024-07-02 |
| 12010924 | Method for manufacturing semiconductor structure with memory device | Chih-Pin Chiu, Chang-Lin Yang, Chien-Hua Huang, Chen-Chiu Huang, Chih-Fan Huang | 2024-06-11 |
| 12004431 | Structure and method for MRAM devices | Tsung-Chieh Hsiao, Po-Sheng Lu, Wei-Chih Wen, Liang-Wei Wang, Yu-Jen Wang +1 more | 2024-06-04 |
| 11996356 | Low-stress passivation layer | Hsiang-Ku Shen, Chun-Li Lin | 2024-05-28 |
| 11990401 | Back-end-of-line passive device structure | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Chen-Chiu Huang | 2024-05-21 |
| 11967573 | Redistribution layers and methods of fabricating the same in semiconductor devices | Hsiang-Ku Shen | 2024-04-23 |
| 11961880 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Hsiang-Ku Shen, Tsung-Chieh Hsiao, Ying-Yao Lai | 2024-04-16 |
| 11950432 | Semiconductor packages and method of manufacturing the same | Hsiang-Ku Shen, Ku-Feng Lin, Liang-Wei Wang | 2024-04-02 |
| 11937515 | MRAM structure for balanced loading | Chih-Fan Huang, Hsiang-Ku Shen, Liang-Wei Wang, Chen-Chiu Huang, Yen-Ming Chen | 2024-03-19 |
| 11923405 | Metal-insulator-metal structure and methods of fabrication thereof | Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen +2 more | 2024-03-05 |