Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107054 | Semiconductor package, semiconductor device and shielding housing of semiconductor package | Nuo Xu, Yuan-Hao Chang, Zhiqiang Wu | 2024-10-01 |
| 12022664 | Magnetic device structure and methods of forming the same | Jui-Lin Chen, Chenchen Jacob Wang, Hsin-Wen Su, Ping-Wei Wang, Yuan-Hao Chang +1 more | 2024-06-25 |
| 12004431 | Structure and method for MRAM devices | Tsung-Chieh Hsiao, Wei-Chih Wen, Liang-Wei Wang, Yu-Jen Wang, Dian-Hau Chen +1 more | 2024-06-04 |