Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080753 | Device structure with a redistribution layer and a buffer layer | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Dian-Hau Chen | 2024-09-03 |
| 11961880 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Hsiang-Ku Shen, Tsung-Chieh Hsiao, Dian-Hau Chen | 2024-04-16 |