Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142582 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hsiao Ching-Wen, Ming-Da Cheng +1 more | 2024-11-12 |
| 12087648 | Seal ring structure with zigzag patterns and method forming same | Kuan-Hung Chen, Po-Hao Tsai, Mirng-Ji Lii | 2024-09-10 |
| 12057423 | Bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Ching-Wen Hsiao, Ming-Da Cheng | 2024-08-06 |
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Ming-Da Cheng, Ching-Wen Hsiao, Yao-Chun Chuang, Yu-Tse Su, Chen-Shien Chen | 2024-07-16 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Ting-Li Yang, Po-Hao Tsai, Ching-Wen Hsiao, Yu-Tse Su | 2024-02-20 |