Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057423 | Bump integration with redistribution layer | Po-Hao Tsai, Ching-Wen Hsiao, Hong-Seng Shue, Ming-Da Cheng | 2024-08-06 |
| 11955423 | Semiconductor device and method | Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2024-04-09 |
| 11942398 | Semiconductor device having at least one via including concave portions on sidewall | Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2024-03-26 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Po-Hao Tsai, Ching-Wen Hsiao, Hong-Seng Shue, Yu-Tse Su | 2024-02-20 |
| 11901266 | Semiconductor device structure and method for forming the same | Wen-Hsiung Lu, Lung-Kai Mao, Fu Wei Liu, Mirng-Ji Lii | 2024-02-13 |
| 11862588 | Semiconductor device and method | Chen-Shien Chen, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2024-01-02 |