Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2024-12-31 |
| 12119276 | Package structure with protective lid | Wen-Yi Lin, Kuang-Chun Lee, Chen-Shien Chen | 2024-10-15 |
| 12019097 | Method for forming probe head structure | Wen-Yi Lin, Hao Chen, Chuan-Hsiang Sun, Mill-Jer Wang, Chen-Shien Chen | 2024-06-25 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Shih-Yen Chen +7 more | 2024-05-14 |
| 11862588 | Semiconductor device and method | Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng | 2024-01-02 |