Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2024-12-31 |
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Wen-Ming Chen, Chun-Yen Lo, Kuo-Chio Liu | 2024-09-10 |
| 11948876 | Package structure with through vias | Ling Li, Jung-Hua Chang | 2024-04-02 |