Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Kuo-Chio Liu | 2024-09-10 |
| 11908843 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Bingchien Wu, Wei-Jen Wu | 2024-02-20 |