Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2024-12-31 |
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Chun-Yen Lo | 2024-09-10 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2024-07-30 |
| 12046588 | Package on package structure | Dong Shen, Chen-Shien Chen, Hsi-Kuei Cheng, Yi-Jen Lai | 2024-07-23 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2024-05-14 |
| 11923353 | LTHC as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen | 2024-03-05 |