Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Chung-Yi Lin +2 more | 2024-07-30 |
| 12002872 | Structure and formation method of semiconductor device structure | Po-Chi Wu, Chai-Wei Chang, Yi-Cheng Chao | 2024-06-04 |