Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176297 | Semiconductor device package | Hao-Chih Hsieh, Tzu-Cheng Lin | 2024-12-24 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2024-07-30 |
| 12021134 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2024-06-25 |
| 11876551 | Electronic module | Shih-Wen Lu, Po-Hsiang Tseng, Hsin-Han Lin, Ming-Lun Yu | 2024-01-16 |