Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2024-07-30 |
| 12046588 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Yi-Jen Lai | 2024-07-23 |
| 11990454 | Package structure and method of forming the same | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2024-05-21 |
| 11984342 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2024-05-14 |
| 11948881 | Semiconductor structure | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2024-04-02 |
| 11923353 | LTHC as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Chen-Shien Chen, Kuo-Chio Liu | 2024-03-05 |