Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990454 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2024-05-21 |
| 11984342 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2024-05-14 |
| 11948881 | Semiconductor structure | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2024-04-02 |