Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131911 | CMP process and methods thereof | Che-Lun Chang, Pin-Chuan Su, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang +1 more | 2024-10-29 |
| 11990454 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2024-05-21 |
| 11984342 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2024-05-14 |
| 11948881 | Semiconductor structure | Hsi-Kuei Cheng, Chih-Kang Han, Ching Fu Chang | 2024-04-02 |
| 11901303 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2024-02-13 |