Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131911 | CMP process and methods thereof | Pin-Chuan Su, Hsin-Chieh Huang, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang +1 more | 2024-10-29 |
| 12040407 | Semiconductor devices including backside vias and methods of forming the same | Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng | 2024-07-16 |
| 12014919 | Dielectric layer, interconnection structure using the same, and manufacturing method thereof | Yi-Chen Ho, You-Hua Chou, Yen-Hao LIAO, Zhen-Cheng Wu | 2024-06-18 |
| 11935781 | Integrated circuit structure with backside dielectric layer having air gap | Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng | 2024-03-19 |
| 11862709 | Inner spacer structure and methods of forming such | Jiun-Ming Kuo, Ji-Yin Tsai, Yuan-Ching Peng | 2024-01-02 |