YL

Yi-Jen Lai

TSMC: 3 patents #1,177 of 4,162Top 30%
Overall (2024): #59,903 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12051634 Package and package-on-package structure having elliptical columns and ellipsoid joint terminals Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more 2024-07-30
12046588 Package on package structure Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng 2024-07-23
11923353 LTHC as charging barrier in info package formation Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu 2024-03-05