SY

Sheng-Yao Yang

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #267,214 of 561,600Top 50%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12183709 Chip package structure with ring-like structure Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more 2024-12-31