Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2024-12-31 |
| 12027603 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang +1 more | 2024-07-02 |
| 11901433 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang +1 more | 2024-02-13 |