Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Chien-Chen Li, Shih-Yen Chen +7 more | 2024-05-14 |
| 11973010 | Chip packaging method and chip package unit | Hao-Lin Yen, Yong-Zhong Hu | 2024-04-30 |