Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009337 | Bonding tool and bonding method thereof | Chih-Yuan Chiu, Chi-Chun Peng, HONG-KUN CHEN, Hui-Ting Lin | 2024-06-11 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2024-05-14 |