HC

HONG-KUN CHEN

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Liuzhou, CN: #1 of 10 inventorsTop 10%
Overall (2024): #442,449 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12009337 Bonding tool and bonding method thereof Chih-Yuan Chiu, Shih-Yen Chen, Chi-Chun Peng, Hui-Ting Lin 2024-06-11